FT-3000

It integrates high precision, high efficiency, low vibration and low noise, and effectively improves efficiency by 50% and accuracy by 30%.

The alignment position is coincident with the test position to ensure the long-term stability of the comprehensive accuracy.
Compatible with wafer and frame iron ring transmission test.
High rigidity Z worktable.
Double mechanical arm transmission automatic loading and unloading system.
Support Hard Docking/Direct Docking/Cable test of various test systems.
Precision optical modules and advanced image algorithms to achieve automatic alignment, automatic needle alignment.
Support Wafer ID reading (front/back optional).
The needle grinding table is equipped with automatic needle grinding, and the brush needle cleaning is optional.
Multi-Bin classification display Mapping function is provided to facilitate the analysis of wafer parameter distribution.
Supports 8 "/12" Wafer pre-alignment and 2-8-1, 2-12-1 hoop auto-alignment.
Support 8 "/12" Wafer and 2-8-1, 2-12-1 hoop transmission.
Support 12 "FOUP/12"OPEN/8"OPEN, 13 slots 12"Metal Frame Cassette, 25 slots 8"Metal Frame Cassette multiple specifications of material box and corresponding products.
Support the automatic docking of the factory crown block.
Chinese interface, intuitive and easy to understand.